Temperature resistant and liquid epoxy resin system, specially for the industrial use. Non-corrosive, anti-magnetic, cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector, as well as in many other industrial areas subjected to high thermal stress.
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Technical Data Sheet:
DownloadSafety Data Sheet (MSDS):
DownloadREFERENCE NUMBERS
IMPA: 812904
ISSA: 75.509.08
